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  1 mosfet mosfet mosfet mosfet 70a 70a 70a 70a 450 450 450 450 500v 500v 500v 500v PD10M441L pd10m440 l p2h10m441l ? p2h10m440 l 1 y~?? grade   rating g ? symbol PD10M441L/p2h10m441l pd10m440l/p2h10m440l o? unit 450 500 ???~1? ?y drain-source voltage v dss v gs =0v v ???~1? ?y gate-source voltage v gss ? 20 v duty=50% 70 ) c=25 ? ??? ?v  continuous drain current d.c. i d 50 ) c=25 ? a ???? ?v pulsed drain current i dm 140 ) c=25 ? a
? ? total power dissipation p d 500 ) c=25 ? w ?^
?9 s c? operating junction temperature range t jw  40 ? +150 ? ? - 9 s c? storage temperature range t stg  40 ? +125 ? ? 2000
? 1y rms isolation voltage v iso z? - ?? ,ac1 ? terminals to base, ac 1 min . v 3.0 ? .  ?? module base to heat sink   ???? mounting torque f tor 2.0  z? ?? bus bar to main terminals  n ~ m PD10M441L/440l PD10M441L/440l PD10M441L/440l PD10M441L/440l p2h10m441l/440l p2h10m441l/440l p2h10m441l/440l p2h10m441l/440l ?? approximate weight :220g ?? approximate weight :220g  ?? ?? ?? ?? ? maximum ratings 108.0 108.0
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- 308 - 120 100 80 60 40 20 0 02468 1 0 1 2 drain current i d (a) drain t o source vol t age v ds (v) t c =25 ? 250 s pulse test 10v 4v v gs =5v 6v fig. 1 typical output characteristics 30 24 18 12 6 0 1 2 5 1 0 2 0 5 0 100 cap acit ance c (nf) drain t o source vol t age v ds (v) v gs =0v f=1khz c oss c rss c iss fig. 4 typical capacitance fig. 4 vs. drain-source voltage 1000 500 100 200 50 20 10 2 5 1 0 2 0 5 0 200 100 switching time t (ns) r g =7 v dd =250v t c =25 ? 80 s pulse test t d (off) t d (on) t r t f fig. 7 typical switching time fig. 7 vs. drain current 500 50 200 100 20 10 5 1 2 0.5 1 2 5 10 20 50 100 500 200 1000 drain current i d (a) drain t o source vol t age v ds (v) t c =25 ? t j =150 ? max single pulse 10 s 1ms 10ms dc 100 s -441l -440l operation in this area is limited by r ds (on) fig. 10 maximum safe operating area 12 10 8 6 4 2 0 0 4 8 12 16 drain t o source on vol t age v ds (on)(v) ga te t o source vol t age v gs (v) t c =25 ? 250 s pulse test i d =85a 40a 20a fig. 2 typical drain-source on-voltage fig. 2 vs. gate-source voltage 16 12 8 4 0 0 100 200 300 400 500 600 ga te t o source vol t a ge v gs (v) t o t a l ga te chrage q g (nc) i d =50a 100v 250v 400v v dd = fig. 5 typical gate charge fig. 5 vs. gate-source voltage 120 100 80 60 40 20 0 0 0.2 0.4 0.6 0.8 1.0 1.2 source current i s (a) source t o drain vol t age v sd (v) 250 s pulse test t j =125 ? t j =25 ? fig. 8 typical source-drain diode forward fig. 8 characteristics 10 -2 2 10 0 5 2 10 -1 5 2 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 normalized transient thermal impedance [r th(j-c) / r th(j-c) ] pulse dura tion t (s) per unit base r th(j-c) =0.25 ? /w 1 shot pulse fig. 11 normalized transient thermal impedance(mosfet) 0.2 0.1 0 -40 0 4 0 8 0 120 160 drain t o source on vol t age v ds (on)(v) junction tempera ture t j ( ) v gs =10v 250 s pulse test i d =85a 40a 20a fig. 3 typical drain-source on voltage fig. 3 vs. junction temperature 10 5 1 2 0.5 0.2 0.1 2 5 10 20 50 100 200 switching time t ( s) i d =40a v dd =250v t c =25 ? 80 s pulse test series ga te impedance r g ( ) toff ton fig. 6 typical switching time fig. 6 vs. series gate impedance 2000 1000 200 500 100 50 0 100 200 300 400 500 600 reverse recover y time t rr (ns) reverse current i r (a) i s =70a i s =40a t j =150 ? -dis/dt (a/ s) t rr i r fig. 9 typical reverse recovery characteristics m o s f e t


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